I am running into the following problem building coreboot v3 for an AMD Geode LX board that my company is developing:
Building coreboot v3... CP build/config.h GEN build/build.h BUILD build/coreboot.bootblock cat: write error: No space left on device make[1]: *** [/usr/src/tinygx/buildrom/buildrom-devel/work/coreboot-v3/svn/build/coreboot.bootblock] Error 1 make: *** [/usr/src/tinygx/buildrom/buildrom-devel/work/coreboot-v3/svn/build/coreboot.rom] Error 2
The stage0.init file is 4294967296 bytes and the coreboot.bootblock file is 3940851712 bytes long. The configuration that I am building is derived from the AMD DB800 board, but with an ITE Super I/O instead on the Winbond one. I have attached the .config files from the autobuilder and from coreboot itself. I would be grateful for any insight that can be provided.