[XS] Change in flashrom[main]: flashchips/winbond: Update test status for Winbond W25Q256JV_M

[Matt DeVillier (Code Review)]

Matt DeVillier has uploaded this change for review. ( https://review.coreboot.org/c/flashrom/+/85896?usp=email )

Change subject: flashchips/winbond: Update test status for Winbond W25Q256JV_M
......................................................................

flashchips/winbond: Update test status for Winbond W25Q256JV_M

Tested probe, read, erase, write, and WP operations on a Winbond
W25Q256JV_M chip using internal and raiden_debug_spi programmers.

Change-Id: I48f37665c9578c4fdb360111f20958fbccc51a37
Signed-off-by: Matt DeVillier 
---
M flashchips/winbond.c
1 file changed, 1 insertion(+), 1 deletion(-)

git pull ssh://review.coreboot.org:29418/flashrom refs/changes/96/85896/1

diff --git a/flashchips/winbond.c b/flashchips/winbond.c
index 6d46dcc..973bf2c 100644
--- a/flashchips/winbond.c
+++ b/flashchips/winbond.c
@@ -601,7 +601,7 @@
    	/* supports SFDP */
    	/* OTP: 1024B total, 256B reserved; read 0x48; write 0x42, erase 0x44, read ID 0x4B */
    	.feature_bits	= FEATURE_WRSR_WREN | FEATURE_OTP | FEATURE_4BA | FEATURE_WRSR2,
-		.tested		= TEST_OK_PREW,
+		.tested		= TEST_OK_PREWB,
    	.probe		= PROBE_SPI_RDID,
    	.probe_timing	= TIMING_ZERO,
    	.block_erasers	=