Keith Hui has uploaded this change for review. ( https://review.coreboot.org/c/flashrom/+/38578 )
Change subject: flashchips: Add W25Q64.V.M ......................................................................
flashchips: Add W25Q64.V.M
Add Winbond W25Q64JV?M SPI flash chip.
Some tests were done on a W25Q64JVSSIM mounted on a Sparkfun SOIC-DIP adapter, connected to an Arduino Mega 2560 r3 loaded with frser-duino. Probe and read works, but instability were observed in the connection between Arduino and the chip, so this is being submitted as untested.
Datasheet: https://www.winbond.com/resource-files/w25q64jv%20revj%2003272018%20plus.pdf
Change-Id: Ib7749835178ee6a1b0fe579e7a0c29e69a67933b Signed-off-by: Keith Hui buurin@gmail.com --- M flashchips.c M flashchips.h 2 files changed, 41 insertions(+), 0 deletions(-)
git pull ssh://review.coreboot.org:29418/flashrom refs/changes/78/38578/1
diff --git a/flashchips.c b/flashchips.c index 65dda0e..bfa2927 100644 --- a/flashchips.c +++ b/flashchips.c @@ -16936,6 +16936,46 @@
{ .vendor = "Winbond", + .name = "W25Q64.V.M", + .bustype = BUS_SPI, + .manufacture_id = WINBOND_NEX_ID, + .model_id = WINBOND_NEX_W25Q64_V_M, + .total_size = 8192, + .page_size = 256, + /* supports SFDP */ + /* OTP: 1024B total, 256B reserved; read 0x48; write 0x42, erase 0x44, read ID 0x4B */ + .feature_bits = FEATURE_WRSR_WREN | FEATURE_OTP | FEATURE_QPI, + .tested = TEST_UNTESTED, + .probe = probe_spi_rdid, + .probe_timing = TIMING_ZERO, + .block_erasers = + { + { + .eraseblocks = { {4 * 1024, 2048} }, + .block_erase = spi_block_erase_20, + }, { + .eraseblocks = { {32 * 1024, 256} }, + .block_erase = spi_block_erase_52, + }, { + .eraseblocks = { {64 * 1024, 128} }, + .block_erase = spi_block_erase_d8, + }, { + .eraseblocks = { {8 * 1024 * 1024, 1} }, + .block_erase = spi_block_erase_60, + }, { + .eraseblocks = { {8 * 1024 * 1024, 1} }, + .block_erase = spi_block_erase_c7, + } + }, + .printlock = spi_prettyprint_status_register_plain, + .unlock = spi_disable_blockprotect, + .write = spi_chip_write_256, + .read = spi_chip_read, + .voltage = {2700, 3600}, + }, + + { + .vendor = "Winbond", .name = "W25Q64.W", .bustype = BUS_SPI, .manufacture_id = WINBOND_NEX_ID, diff --git a/flashchips.h b/flashchips.h index 14ab6de..bdfadad 100644 --- a/flashchips.h +++ b/flashchips.h @@ -938,6 +938,7 @@ #define WINBOND_NEX_W25Q32_W 0x6016 /* W25Q32DW; W25Q32FV in QPI mode */ #define WINBOND_NEX_W25Q64_W 0x6017 /* W25Q64DW; W25Q64FV in QPI mode */ #define WINBOND_NEX_W25Q128_W 0x6018 /* W25Q128FW; W25Q128FV in QPI mode */ +#define WINBOND_NEX_W25Q64_V_M 0x7017 /* W25Q64JVSIM */ #define WINBOND_NEX_W25Q128_V_M 0x7018 /* W25Q128JVSM */ #define WINBOND_NEX_W25Q256JV_M 0x7019 /* W25Q256JV_M (QE=0) */ #define WINBOND_NEX_W25Q128_DTR 0x8018 /* W25Q128JW_DTR */