Change in flashrom[master]: flashchips: Add Windbond 25Q40EW and rename 25Q40.W

[Nico Huber (Code Review)]

Nico Huber has uploaded this change for review. ( https://review.coreboot.org/25462

Change subject: flashchips: Add Windbond 25Q40EW and rename 25Q40.W
......................................................................

flashchips: Add Windbond 25Q40EW and rename 25Q40.W

Same story as for 25Q80BW/EW, 25Q40EW has a new ID and the only known
chip with the old ID is the BW variant.

Change-Id: Ib610b0d6f3a5561b2ac3505ef15bdee8b0edae25
Signed-off-by: Nico Huber 
---
M flashchips.c
M flashchips.h
2 files changed, 44 insertions(+), 3 deletions(-)

git pull ssh://review.coreboot.org:29418/flashrom refs/changes/62/25462/1

diff --git a/flashchips.c b/flashchips.c
index 70057d4..5a8e606 100644
--- a/flashchips.c
+++ b/flashchips.c
@@ -15027,10 +15027,10 @@

{
    	.vendor		= "Winbond",
-		.name		= "W25Q40.W",
+		.name		= "W25Q40BW",
    	.bustype	= BUS_SPI,
    	.manufacture_id	= WINBOND_NEX_ID,
-		.model_id	= WINBOND_NEX_W25Q40_W,
+		.model_id	= WINBOND_NEX_W25Q40BW,
    	.total_size	= 512,
    	.page_size	= 256,
    	/* OTP: 256B total; read 0x48; write 0x42, erase 0x44, read ID 0x4B */
@@ -15102,6 +15102,46 @@
    	.read		= spi_chip_read,
    	.voltage	= {1700, 1950}, /* Fast read (0x0B) and multi I/O supported */
    },
+
+	{
+		.vendor		= "Winbond",
+		.name		= "W25Q40EW",
+		.bustype	= BUS_SPI,
+		.manufacture_id	= WINBOND_NEX_ID,
+		.model_id	= WINBOND_NEX_W25Q40EW,
+		.total_size	= 512,
+		.page_size	= 256,
+		/* OTP: 3*256B total; read 0x48; write 0x42, erase 0x44, read ID 0x4B */
+		.feature_bits	= FEATURE_WRSR_WREN | FEATURE_OTP,
+		.tested		= TEST_UNTESTED,
+		.probe		= probe_spi_rdid,
+		.probe_timing	= TIMING_ZERO,
+		.block_erasers	=
+		{
+			{
+				.eraseblocks = { {4 * 1024, 128} },
+				.block_erase = spi_block_erase_20,
+			}, {
+				.eraseblocks = { {32 * 1024, 16} },
+				.block_erase = spi_block_erase_52,
+			}, {
+				.eraseblocks = { {64 * 1024, 8} },
+				.block_erase = spi_block_erase_d8,
+			}, {
+				.eraseblocks = { {512 * 1024, 1} },
+				.block_erase = spi_block_erase_60,
+			}, {
+				.eraseblocks = { {512 * 1024, 1} },
+				.block_erase = spi_block_erase_c7,
+			}
+		},
+		.printlock	= spi_prettyprint_status_register_plain, /* TODO: improve */
+		.unlock		= spi_disable_blockprotect,
+		.write		= spi_chip_write_256,
+		.read		= spi_chip_read,
+		.voltage	= {1650, 1950}, /* Fast read (0x0B) and multi I/O supported */
+	},
+
    {
    	.vendor		= "Winbond",
    	.name		= "W25Q80EW",
diff --git a/flashchips.h b/flashchips.h
index 68a67fa..1bd2c92 100644
--- a/flashchips.h
+++ b/flashchips.h
@@ -910,8 +910,9 @@
 #define WINBOND_NEX_W25Q128_V	0x4018	/* W25Q128BV; W25Q128FV in SPI mode (default) */
 #define WINBOND_NEX_W25Q256_V	0x4019	/* W25Q256FV */
 #define WINBOND_NEX_W25Q20_W	0x5012	/* W25Q20BW */
-#define WINBOND_NEX_W25Q40_W	0x5013	/* W25Q40BW */
+#define WINBOND_NEX_W25Q40BW	0x5013	/* W25Q40BW */
 #define WINBOND_NEX_W25Q80BW	0x5014	/* W25Q80BW */
+#define WINBOND_NEX_W25Q40EW	0x6013	/* W25Q40EW */
 #define WINBOND_NEX_W25Q80EW	0x6014	/* W25Q80EW */
 #define WINBOND_NEX_W25Q16_W	0x6015	/* W25Q16DW */
 #define WINBOND_NEX_W25Q32_W	0x6016	/* W25Q32DW; W25Q32FV in QPI mode */